How this tool helps you Speeds up solder removal and cleanup so you finish repairs faster. Provides precise control to protect delicate electronic components during desoldering. Reduces the risk of accidental damage by removing molten solder quickly and cleanly. How to use 1. Place the nozzle directly over the target solder joint after the solder has melted. 2. Press the trigger; the retractable plunger creates a strong vacuum that efficiently draws unwanted solder into the nozzle. 3. Release and empty the collected solder as needed. Key features and specifications Precision and control: Designed to minimize heat exposure and mechanical stress on sensitive components during tin extraction. Ergonomic design: Comfortable hand grip for easy, fatigue-free operation during repeated use. Size and build: Approximately 185 x 20 mm; constructed from high-quality aluminium and plastic for durability and light weight. Performance: Maximum vacuum strength up to 32 cm Hg for reliable solder pickup. Versatility: Compatible with a variety of soldering and desoldering tasks and different types of solder, making it suitable for hobbyists and professionals. Typical use scenarios PCB repair and rework: Remove solder from through-hole and surface-mount pads when replacing components on motherboards, control boards, or small electronics. Mobile device and laptop repairs: Cleanly extract solder from connectors and small joints when replacing ports, switches, or chips. Electronics prototyping and hobby projects: Quickly clear solder bridges and tidy joints while assembling or modifying circuits. Why choose this model Practical size and robust materials deliver reliable performance without added bulk. Simple trigger operation and a retractable plunger provide consistent suction for clean, controlled solder removal. Suitable for a wide range of soldering/desoldering applications where precision and component safety matter.